Adhesive Serviceable at Cryogenic Temperatures

Master Bond EP29LPSP is a compound capable of withstanding temperatures as low as 4K and can resist cryogenic shocks (i.e. room temperature down to liquid helium temperatures in a 5-10 minute time period).

Master Bond EP29LPSP has a mix ratio of 100 to 65 by weight. It cures at room temperatures, but best results are obtained if heat cured at 130-165°F for 6-8 hours. EP29LPSP features superior physical strength properties and excellent chemical resistance. It bonds well to a variety of substrates including metals, glass, ceramics and many different plastics. When curing, EP29LPSP has a low exotherm.

EP29LPSP has a low viscosity and is easy to apply. Its mixed viscosity is 400 cps. It has a tensile strength of 6,500 psi and a tensile modulus o >375,000 psi. When cured, EP29LPSP is a superior electrical insulator. Its volume resistivity i >10¹⁵ ohm-cm and its dielectric constant is 3.6. It has a Shore D hardness of 80.

Master Bond EP29LPSP is optically clear. It is available for use in pint, quart, gallon and 5 gallon kits. It is also available in syringe applicators.

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