05 Jul 2016
3-year collaboration between Intel and Cork research institute focused on photonics and future electronics.Intel and Tyndall National Institute in Cork have renewed a $1.5 million research partnership. Intel has committed to invest $1.5 million over the next three years in developing innovative technology with Tyndall, building on the investment of previous phases and reflecting the success of their collaborative research. The partnership, which has gone through two 3-year phases since 2009, will now run until 2018.
The agreement between Intel and Tyndall involves a direct relationship between researchers at Tyndall and Intel's components research group in Portland, Oregon. The transatlantic partners will work together to investigate next-generation materials, devices and photonics technologies.
Tyndall's expertise in the field of semiconductor technology is key to the partnership with Intel, and both organizations anticipate building on the work of the previous phases of the program to help with developing future electronic devices. As in previous years, the partnership provides Intel with a commercial exploitation licence to technology created through the collaboration with Tyndall.
Bernie Capraro, Research Manager, Silicon Technology at Intel Ireland, said “The standard of work from Tyndall researchers is top-class, from the work that Dr. Jim Greer does in device modeling to the photonics work of Brian Corbett. The researchers in Tyndall will be working directly with Intel's researchers in Portland, which is the essence of the program and what makes it so effective. We particularly appreciate Tyndall’s flexibility, because we do alter the research program from year to year depending on what needs we have and how our interests change.”
Intel emphasized that Tyndall's industry-focused approach and broad knowledge across the spectrum of ICT initially attracted the company to work with the institute on a long-term basis. “This partnership started six years ago, and what we liked about Tyndall was the breadth of technology that they offered,” added Capraro.
He added, “Because of that breadth, it made sense for us to sponsor a large program. Often, Tyndall researchers bring solutions to Intel – rather than us going to them with a problem, they will come to us with an opportunity. We appreciate Tyndall’s assistance in looking into the future of semiconductor technology and Moore's Law, and their insights in evaluating potential future solutions.”
‘New thought and a new approach’
“We have excellent scientists who have a creative approach to future challenges associated with the extension of Moore's Law and Intel's migration towards a focus on the Internet of Things,” Drain added. “We are looking forward to continuing to work with Intel on major challenges, such as scaling, and examining new transistor architectures for high-density chips that can have a clear path to manufacturing with attractive economics. It requires new thought and a new approach to ensure that as chips get smaller and more power efficient, they also continue to get less expensive.”
The latest phase of the research partnership between Intel and Tyndall National Institute will run until 2018, under the direction of Bernie Capraro, Research Manager, Silicon Technology at Intel Ireland, and Peter Smyth, Business Development Executive at Tyndall.