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| Imec’s Si photonics 200mm wafer platform offers extensive design flexibility and includes: tight within-wafer silicon thickness variation 3sigma < 2.5nm; 3-level patterning of 220nm top Si layer (193nm optical lithography); poly-Si overlay and patterning (193nm optical lithography); and 3-level n-type implants and 3-level p-type implants in silicon. |
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