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30 Dec 19
Submarine optical cables offer potential as billions of seismic sensors

French research group says existing infrastructure could detect earthquakes, swell and underwater noise.

23 Dec 19
Femtosecond laser scribing key to organic solar advance

Fraunhofer-led effort looking to scale low-cost photovoltaic materials to industrial level.

19 Dec 19
Liftoff for Cheops, ESA’s exoplanet mission

High-precision photometer on board will search for “Earthlike” exoplanets; successfully sent into orbit after delayed launch.

18 Dec 19
Multispectral imager quantifies huge gas blowout from space

European Space Agency photonics kit reveals that Ohio plant leaked more than 50 kilotons of methane over 20 days.

18 Dec 19
Compound Photonics launches ‘smallest’ 2Kx2K microdisplay for AR/MR

Company says there is a market need for larger, symmetrical field of view for more naturalistic viewing.

16 Dec 19
Aeva launches ‘4D’ LiDAR on chip for autonomous driving

Sensing systems developer also claims vote of confidence from VW Group with Porsche SE investment.

12 Dec 19
LiDAR with MEMs beamsteering launched for autonomous vehicles

Draper’s technology enables self-driving cars to perceive surroundings at greater distances.

11 Dec 19
Bruker light-sheet microscopy platform offers 3D imaging of cells

TruLive3D Imager from Luxendo subsidiary allows analysis of organoids in natural environments.

10 Dec 19
ESO signs contract for M5 ELT mirror support cell

ENER Aerospacial to make component with fast tip-tilt mechanism for image stabilization.

10 Dec 19
Laser atom cooler and hyperspectral kit arrive in orbit

Photonics-enabled science payloads complete journey to International Space Station.

09 Dec 19
LIDAR based on diode-pumped alexandrite to monitor upper atmosphere

Leibniz-Institute of Atmospheric Physics and Fraunhofer ILT have developed portable, lower-energy demand system.

06 Dec 19
Plessey develops native Red InGaN LEDs on silicon

New approach to microLED is attractive because it offers lower manufacturing costs and scalability to larger wafers.

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