SET

In 1975, SET -Smart Equipment Technology- began designing and manufacturing semiconductor equipment dedicated to high-precision applications.

Today, we are a leading global supplier of high-accuracy Flip-Chip Bonders and versatile nanoimprint lithography (NIL) solutions.

With our Flip-Chip Bonders installed in diverse locations worldwide, SET is renowned for unsurpassed sub-micron accuracy and the superior flexibility of our equipment.

We capably support semiconductor laboratories and companies that desire exacting precision and unquestioned reliability in the assembly of their components.