daily coverage of the optics & photonics industry and the markets that it serves
Featured Showcases
Photonex+Vacuum Technologies

In the BSI approach, OmniVision's traditional CameraChip sensor is turned upside down so that it collects light through what was previously the backside of the sensor, the silicon substrate. This approach differs from conventional FSI image sensors, where the amount of light reaching the photosensitive area is limited by the multiple metal and dielectric layers required to enable the sensor to convert photons into electrons.

Image Credit: OmniVision

Copyright © 2021 SPIE EuropeDesigned by Kestrel Web Services