19 Oct 2006
Gathered in Barcelona this week for the 2006 International Symposium on EUV Lithography, several key industry representatives highlighted developments in areas critical to EUV development and commercialization.
ASML and its partners in the semiconductor lithography field have been working on new applications of extreme ultraviolet (EUV) lithography. ASML, based in Veldhoven, the Netherlands, manufactures advanced lithography and stepper systems for the semiconductor industry. This week, the group has reported on the latest developments and potential applications in EUV technology.
In August 2006, ASML shipped what it called the industry's first full-field EUV exposure tools to R&D centers in Europe and the United States. The shipments of "Alpha Demo Tools" followed ASML's demonstration of key lithography performance targets for EUV development, including full-field imaging and overlay. In addition, ASML has received the first order from a customer for a pre-production EUV system.
"The delivery of our EUV Alpha Demo Tools and the milestones reached by our EUV partners will support the further development of EUV technology," said Martin van den Brink, executive VP marketing and technology at ASML. "EUV pre-production tools could be shipping as early as 2009."
Gathered for the 2006 International Symposium on Extreme Ultraviolet Lithography, between 15-18 October in Barcelona, several industry players highlighted their respective EUV technology developments in areas critical to EUV development and commercialization. Together, these suppliers are working to ensure that EUV lithography becomes a viable exposure technology for the 32 nm node and below.
• Carl Zeiss SMT has successfully manufactured the optical trains for the ASML Alpha Demo Tools, having met all key specifications. The entire EUV optics infrastructure has been built, and technology development in mirror fabrication, coatings, mechatronics, and system metrology is on track for the shipment of EUV production tool optics near the end of the decade.
• Cymer said it is committed to the commercialization of EUV source technology for high-volume manufacturing lithography applications beginning with the 32 nm node in 2009. Significant advances in Laser Produced Plasma technology have been realized that indicate scaling to meet the performance and reliability requirements of a commercially viable EUV production tool. Cymer has established partners to create an industry infrastructure for the production of key components such as Normal Incidence Collectors to insure availability of all required critical technology.
• Philips Extreme UV GmbH supplied the two EUV sources for the ASML Alpha Demo Tools, which will provide the data needed to prepare EUV sources for high volume manufacturing. The company continues to improve the power output of its sources based on its inherently scalable architecture.
• Rohm & Haas Electronic Materials said that it has achieved major breakthroughs this year. "The selection of our MET-2D photoresist for use in ASML's Alpha Demo Tool easily demonstrated 40 nm, 1:1 feature resolution," said Jim Thackeray, R&HEMT Fellow. "We've also developed resists that extend line/space resolution to 35 nm, contact hole resolutions to sub-40 nm, and a chemical amplification resist with 25 nm resolution."
• Toppan Photomasks, as the supplier of photomasks for ASML's EUV Alpha Demo Tools, is working with the lithography supply chain on the continued development of EUV technology. "We are confident that through continued collaboration with our customers, technology leaders such as ASML and other companies, we will be able to provide a high-quality, commercial supply of EUV masks in support of the industry's roadmap," said Franklin Kalk, executive vice president and CTO.
• Xtreme Technologies reported that following delivery of its commercial discharge produced plasma (DPP) EUV sources in 2003, it has continued within a €multi-million program to build integrated source/collector solutions delivering usable intermediate focus power in the 10 W range. Shipment of first units will start in December 2006. In addition, Xtreme Technologies is pursuing its high power concept targeting a volume production 100 W EUV source for introduction in 2008.
• Some of the EUV R&D programs in Europe have been organized through MEDEA+, a European program funded by national governments of the Netherlands, Germany, France and Belgium; and the IST program known as More Moore supported by the European Commission, involving more than 100 companies, institutes and universities.