 |
 |
Date Announced: 20 Mar 2018
US firm has been working closely with key EUV protagonist ASML.
THOUSAND OAKS, Calif.--(BUSINESS WIRE)--Teledyne Technologies Incorporated (NYSE:TDY) announced today that its subsidiary, Teledyne DALSA, Inc., in partnership with ASML Holding N.V. (ASML) will produce pellicle membranes for use in Extreme Ultraviolet (EUV) lithography-based semiconductor fabrication.
Lithography is a process which patterns the structures on a microchip, and lithography plays an important role in determining how densely chip makers can pack transistors together. As one of the world’s leading manufacturers of chip-making equipment, ASML has designed the EUV lithography platform as an extendible platform that that will enable the continued progress in microchip manufacturing, delivering chip device cost reductions, power savings and performance improvements well into the next decade.
Pellicles are unique, extremely thin transparent membranes which allow transmission of ultraviolet photons while, at the same time, protecting photomasks from particles and contaminants during the semiconductor fabrication process. Pellicles, which are more than 1,000 times thinner than a human hair, must also be rugged enough to withstand very high temperatures during semiconductor processing. Pellicles are consumables which may be replaced a number of times during the life of a photomask, also known as a reticle.
“For nearly three years, Teledyne has worked in close collaboration with ASML on the development of this extremely challenging technology,” said Robert Mehrabian, Chairman, President and Chief Executive Officer of Teledyne. “Having manufactured Micro Electro Mechanical Systems or MEMS for over 20 years and with state of the art 200 mm (8 inch) processing tools, Teledyne has amassed extensive intellectual property and experience in the production of extremely thin films with precise control of mechanical, optical and electrical properties.”
Source: Teledyne Technologies
E-mail: via web site
Web Site: www.teledyne.com
| © 2024 SPIE Europe |
|
