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Teledyne Announces Production Readiness of Wafer Level Packaged Uncooled Infrared Detectors

Date Announced: 14 Feb 2018

Microbolometer process qualified for LWIR imaging.

THOUSAND OAKS, Calif.--(BUSINESS WIRE)--Teledyne Technologies Incorporated (NYSE:TDY) announced today that its subsidiary, Teledyne DALSA, Inc., a global leader in imaging and vision solutions, successfully completed the qualification of a Wafer-Level-Packaged Vanadium Oxide (VOx) Microbolometer process for Long Wave Infrared (LWIR) imaging.

Microbolometers are Micro Electro Mechanical Systems or MEMS-based devices which detect infrared, or thermal, radiation and do not require cooling. Teledyne DALSA’s manufacturing process, located in its captive MEMS foundry in Bromont, Quebec, integrates proprietary low cost Wafer Level Packaging technology that bonds two 200 mm wafers precisely and under high vacuum, forming an extremely compact 3D stack. This technology eliminates the need for conventional chip packaging - which can account for 75% or more of the overall device cost.

“This is an important milestone in our journey to bring a credible price/performance VOx solution to market,” said Robert Mehrabian, Chairman, President and Chief Executive Officer of Teledyne. “With the qualification process complete we will now begin ramping up production lines for a 17-micron pixel 320×240 (QVGA) device, closely followed by a 17-micron 640×480 (VGA), with longer-term plans to introduce a highly compact 12-micron detector family. Among other applications, these new detectors will be offered as modules for OEMs and also integrated into Teledyne DALSA’s Calibir™ camera platform.”

Source: Teledyne Technologies


Cees Draijer
Business Line Manager
IR Products

E-mail: cees.draijer@teledyne.com

Web Site: www.teledyne.com

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