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ams and Qualcomm to co-develop 'active stereo camera' for mobile 3D apps

21 Nov 2018

Proposed solution intended to enable cost-reduced 3D biometrics, facial scanning and imaging from cellphones.

ams, a developer of high-performance sensors, and Qualcomm subsidiary Qualcomm Technologies have announced a joint plan to develop a 3D depth-sensing camera solution for mobile phone applications. These would include 3D imaging and scanning and, in particular, biometric face authentication.

With ams’ VCSEL light sources and optical IR pattern technology incorporating mass-production-proven wafer level optics and Qualcomm’s Snapdragon Mobile Platforms, the companies are intending to create what they call “a reference design for a cost-attractive, active 3D stereo camera solution for Android-based mobile phones.”

Purposes of the platform solution could include front-facing applications that require advanced 3D imaging, such as the standard of face recognition required for secure online payments as well as other functions such as dynamic-depth facial scanning.

“Qualcomm Technologies is committed to providing active depth camera solutions for our customers,” commented Keith Kressin, senior vice president, product management, Qualcomm Technologies. “We’re excited to be working with ams on the development and commercialization of this reference design with the goal of bringing these depth sensing solutions to consumers.”

Alexander Everke, CEO of ams, said, “ams provides the full range of IR illumination devices specifically designed to address the three 3D technologies Active Stereo Vision, Structured Light and Time-of-Flight.

“Utilizing this leading capability together with Qualcomm Technologies’ mobile application processors for active stereo camera solutions is an exciting opportunity. We want to enable fast time-to-commercialization and broad-based availability of high-quality 3D sensing solutions for Android-based smartphones and mobile devices, and this is a step towards this goal.”

ams launches 'slimmest' proximity/color sensor module

In related news, ams has also announced the introduction of a 1.44mm-wide fully integrated color/ambient light/proximity sensor module, which has the ultra-slim package footprint required by the latest narrow-bezel mobile phone industrial designs (see above).

The company commented that the module will “enable manufacturers to better optimize automatic disabling of smartphone touch screens during calls and the adjustment of screen brightness to ambient conditions for more comfortable and lower-energy smartphone use.”

Hyperion OpticsIDS Imaging Development SystemsCHROMA TECHNOLOGY CORP.Berkeley Nucleonics CorporationUniverse Kogaku America Inc.LASEROPTIK GmbHCeNing Optics Co Ltd
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