Optics.org
daily coverage of the optics & photonics industry and the markets that it serves
Featured Showcases
Photonics West Showcase
News
Menu
KITted out: The novel optical wire bond is adapted to the position and orientation of the chips.
KITted out: The novel optical wire bond, linking the semiconductor chips, is adapted to the position and orientation of the chips. (Figure: N. Lindenmann and G. Balthasar).
© 2024 SPIE Europe
Top of Page