Product details
VarioLas Family of Large-Area UV-Microprocessing Solutions Apr 23, 2009
Company details
Coherent, Inc.
5100 Patrick Henry Drive
Santa Clara
CA
95054
United States
Tel:
001 (408) 764-4983
Fax:
001 (408) 988-6838
VarioLas mask imaging and line-beam systems are affordable tools for large-area precision machining. Superior optics, ruggedized mechanics and unmatched pulse stability are the
Request infokey ingredients to each member of the VarioLas family - available for UV wavelengths 193 nm, 248 nm and 308 nm.
VarioLas mask imaging systems ECO and PRO provide micromachining resolutions of 30 µm and 5 µm, respectively, at a rectangular field size of 2 x 2 sq mm and are ideal for UV-machining of materials such as polymers, semiconductors, ceramics or glasses and as well for Laser Lift-Off (LLO) tasks. VarioLas SWEEP supports large-area processing with a homogeneous 50 x 0.6 sq mm line-beam for scanning applications such as wafer dopant activation, laser lift-off or surface annealing. Each VarioLas version can be upgraded to best match the individual requirements.
A variety of safety features such as automated beam shutter and interlock circuit or safety class 1 beam encapsulation can be added to the basic design together with convenient control modules such as on-sample fluence control, motorized substrate stage as well as a collinear camera observation unit enabling live monitoring of ablation results.
Categories
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